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Home>Solder Paste Series>2-4 Non-clean Sn-Pb Solder Paste
Solder Paste Series
2-4 Sn63/37（Sn62-Ag2） solder pastes
2-4-1 Products Characteristics:
1) Specially designed to ensure flux with high reliability and good wettability.
2) Little residue after reflowing, low corrosion and good electrical insulatibity.
3) Flux can effectively prevent collapse when printing and pre-heating.
4) The diameter of tin powder is accurately controlled between 25μm to 45μm, and the flux is specifically made to insure continuously printing and fine pattern.
5) Meet the American standard of ANSI/J-STD-004 flux (ROLO).
6) The viscosity of the paste can maintain for up to 48 hours. More than 8 hours of valid working life.
7) The residue is clear and has no influence on test.
8) Non-clean or easy to clean.
2-4-2 Designation, Melting Point and Alloy Compositions
| Designation | Melting Point (℃) | Alloy Compositions |
| ZY-SN-63(2-4) | 183 | S-Sn63Pb37 |
| ZY-SN-62(2-5) | 179-180 | S-Sn62Pb36Ag2 |
2-4-3 Properties Flux Chemical Composition
| Materials | Contents(%) |
| Resin | 40 |
| Thixotropic agent | 10 |
| Acid | 4 |
| Solvent | 39 |
| Corrosion inhibitor | 3 |
| Viscosity additive | 2 |
| Active polymer | 2 |
2-4-4 Properties（Sn63∕Sn62-Ag2）
| Items | Data | |
| Flux Type | non-clean | |
| Halogen content (%) | ≤0.1 | |
| Powder size (μm) | 25-45 | |
| Melting point（℃） | 183 | |
| Appearance | homogenous paste | |
| Viscosity (Kcps/Pa.s) | 600-1000 | |
| Flux content (wt%) | 10.0±0.5 | |
| Metal content (wt%) | 90±0.5 | |
| Copper mirror corrosion | pass | |
| Copper plate corrosion | pass | |
| Fluoro-point test | pass | |
| SIR(Ω) | Before soldering | >1×1012 |
| Moist resistance | >1×1010 | |
| Resistivity of water extraction(Ω.㎝) | >1×105 | |
| Spread factor(%) | >90 | |
| Shelf life | 6 months (4-8℃) | |
