Solder Bar Series
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Solder Bar Series
Introductions
Zhongya(tianjin) uses the high-purity (99.99%) Sn as raw material, to development the High Purity Series Soldering Bar for wave soldering , dip soldering. This product meets the requirement of the EU RoHS environment directive. In order to meet the requirement of different soldering and adapt to a lot of operating methods , a variety of alloy composition and types of tin bar can be provided for users.
Characteristics
In wave soldering, the composition of solder should be periodically measured in boiler, because the tin content will get low ,meanwhile the content of copper and lead increase. In order to reduce product costs, right amount of high purity series soldering bar or anti-oxidized alloys should be added when the content of copper or lead is close to the standard to maintain the normal tin furnace and wave soldering .
Composition Selection Of Solder Alloys
4-6 Lead-free Solder Bar Alloy Composition Selection Guide
4-6-1 Sn-Cu Alloys
Series | Alloy Composition | Melting Point(℃) | Proposed Temperature | Recommendation |
WH-10 | S-Sn99.90 | 232 | 240-260 | |
WH-11 | S-Sn98Cu2 | -- | -- | |
WH-22 | S-Sn99.7Cu0.3 | 227 | 240-260 | |
WH-23 | S-Sn99.3Cu0.7 | 227 | 240-260 | Widely Used,Economical |
WH-24 | S-Sn99Cu1 | 227-240 | 240-260 | |
WH-25 | S-Sn97Cu3 | 227-275 | 240-260 | |
WH-323 | S-Sn99Cu0.6Ni0.4 | 226 | 240-260 |
4-6-2 Sn-Ag Alloys
Series | Alloy Composition | Melting Point(℃) | Proposed Temperature | Recommendation |
WH-26 | S-Sn97Ag3 | 221-230 | 240-260 | |
WH-27 | S-Sn96.5Ag3.5 | 221 | 240-260 | |
WH-28 | S-Sn96Ag4 | 221-225 | 240-260 | |
WH-331 | S-Sn77In20Ag3 | 178-189 | 240-260 | |
WH-372 | S-Sn99Ag1 | — | — |
4-6-3 Sn-Ag-Cu Alloys
Series | Alloy Compostion | Melting Point(℃) | roposed Temperature | Recommendation |
WH-316 | S-Sn97Ag1Cu2 | — | — | |
WH-326 | S-Sn96.5Ag3Cu0.5Ce | 217-219 | 240-260 | Widely use for high-end electronic products |
WH-327 | S-Sn95.5Ag3.5Cu1 | 218 | 240-260 | |
WH-328 | S-Sn93Ag5Cu2 | 217 | 240-260 | |
WH-329 | S-Sn95Ag4Cu1 | 206-219 | 240-260 | |
WH-373 | S-Sn99Ag0.3Cu0.7 | — | — | For general electronic products |
WH-404 | S-Sn92Ag5Cu2Sb1 | — | — | Military used |
WH-402 | S-Sn96.5Ag2Cu1Sb0.5 | 216-222 | 240-260 |
4-6-4 Sn-Zn (Eutectic) alloys
Series WH-29 | Alloy Compositions S-Sn91Zn9 | Melting Point(℃) 188 | Proposed Tempeture 240-260 | Recommendation |
4-6-5 Sn-Bi-X Alloys
Series WH-330 | Alloy Composition | Melting Point(℃) | Proposed Tempeture | Recommendation |
WH-330 | S-Sn93Ag4Bi3 | 219-221 | 240-260 | |
WH-332 | S-Sn90Bi8Ag2 | 207-212 | 240-260 | |
WH-333 | S-Sn88Zn7Bi5 | 180-198 | 240-260 | |
WH-138 | S-Sn42Bi58 | 138 | 160-180 | Low melting point |
WH-139 | S-Sn64Bi35Ag1 | 139 | -- | Low melting point |
4-6-6 Sn-Sb Alloys
Series WH-210 | Alloy Composition S-Sn95Sb5 | Melting Point(℃) 232 | Proposed Tempeture 240-260 | Recommendation |