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Home>Solder Bar Series>4-1 Anti-oxidized Lead-free Wave Soldering Bar
Solder Bar Series
Zhongya(tianjin) uses the advanced technology of refining and high anti-oxidation, to development the lead-free solder bar for wave soldering and dip soldering, especially for the automatic assembly line in mass production. This product meets the requirement of the EU RoHS environment directive. In order to meet the requirement of different soldering and adapt to a lot of operating methods , a variety of alloy composition and types of tin bar can be provided for users.
Advantages
With high anti-oxidation technology and adding a certain proportion of anti oxygen alloy, we can save the material cost by 16%. The surface of liquid solder is bright, and the solder joint is full, flawless and high-reliability.
Composition Selection Of Solder Alloys
4-6 Lead-free Solder Bar Alloy Composition Selection Guide
4-6-1 Sn-Cu Alloys
| Series | Alloy Composition | Melting Point(℃) | Proposed Temperature | Recommendation |
| WH-10 | S-Sn99.90 | 232 | 240-260 | |
| WH-11 | S-Sn98Cu2 | -- | -- | |
| WH-22 | S-Sn99.7Cu0.3 | 227 | 240-260 | |
| WH-23 | S-Sn99.3Cu0.7 | 227 | 240-260 | Widely Used,Economical |
| WH-24 | S-Sn99Cu1 | 227-240 | 240-260 | |
| WH-25 | S-Sn97Cu3 | 227-275 | 240-260 | |
| WH-323 | S-Sn99Cu0.6Ni0.4 | 226 | 240-260 |
4-6-2 Sn-Ag Alloys
| Series | Alloy Composition | Melting Point(℃) | Proposed Temperature | Recommendation |
| WH-26 | S-Sn97Ag3 | 221-230 | 240-260 | |
| WH-27 | S-Sn96.5Ag3.5 | 221 | 240-260 | |
| WH-28 | S-Sn96Ag4 | 221-225 | 240-260 | |
| WH-331 | S-Sn77In20Ag3 | 178-189 | 240-260 | |
| WH-372 | S-Sn99Ag1 | — | — |
4-6-3 Sn-Ag-Cu Alloys
| Series | Alloy Compostion | Melting Point(℃) | roposed Temperature | Recommendation |
| WH-316 | S-Sn97Ag1Cu2 | — | — | |
| WH-326 | S-Sn96.5Ag3Cu0.5Ce | 217-219 | 240-260 | Widely use for high-end electronic products |
| WH-327 | S-Sn95.5Ag3.5Cu1 | 218 | 240-260 | |
| WH-328 | S-Sn93Ag5Cu2 | 217 | 240-260 | |
| WH-329 | S-Sn95Ag4Cu1 | 206-219 | 240-260 | |
| WH-373 | S-Sn99Ag0.3Cu0.7 | — | — | For general electronic products |
| WH-404 | S-Sn92Ag5Cu2Sb1 | — | — | Military used |
| WH-402 | S-Sn96.5Ag2Cu1Sb0.5 | 216-222 | 240-260 |
4-6-4 Sn-Zn （Eutectic） alloys
| Series WH-29 | Alloy Compositions S-Sn91Zn9 | Melting Point(℃) 188 | Proposed Tempeture 240-260 | Recommendation |
4-6-5 Sn-Bi-X Alloys
| Series WH-330 | Alloy Composition | Melting Point(℃) | Proposed Tempeture | Recommendation |
| WH-330 | S-Sn93Ag4Bi3 | 219-221 | 240-260 | |
| WH-332 | S-Sn90Bi8Ag2 | 207-212 | 240-260 | |
| WH-333 | S-Sn88Zn7Bi5 | 180-198 | 240-260 | |
| WH-138 | S-Sn42Bi58 | 138 | 160-180 | Low melting point |
| WH-139 | S-Sn64Bi35Ag1 | 139 | -- | Low melting point |
4-6-6 Sn-Sb Alloys
| Series WH-210 | Alloy Composition S-Sn95Sb5 | Melting Point(℃) 232 | Proposed Tempeture 240-260 | Recommendation |
