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Flux Series
6-9 FAQ
Frequently Asked Questions and Solutions about Flux
1. The poor contact between flux and board, improper angle of board and solder.
2. Too high or too low proportion of flux.
3. Too fast or too slow conveyor belt speed. The standard speed is 1.2-1.8m/min. The solder joint is sharp and bright with too fast speed, and the solder joint is slightly round and stubby with too slow speed.
4. Anti-oxidation oil in the tin furnace is overmuch or deteriorated.
5. Too low or too high preheat temperature. After soldering, the standard temperature is 75-100 ℃ according to the actual condition.
6. Too low or too high temperature in tin furnace. The standard temperature is 245-255℃, The solder joint is sharp and bright with too low temperature, and the solder joint is slightly round and stubby with too high temperature.
7. Instable wave in tin furnace.
8. The solder containing impurities in furnace.
9. The poor pin direction and array of component.
10. Improper handling of backpanel and lead.
Frequently Asked Questions about solder joint
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GRAINY |
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BRIDGING | ● | ● |
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BALLING |
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SHORTS |
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The Introduction of Wave Soldering and Frequently Asked Questions
Statement
The following text comes from the internet and summaries which from some related equipment manufacturers and engineers. Because of the vast articles from the internet, we can’t contact author or institution timely. If the text involve the patent, please contact us and we will delete relevant contents. Please forgive us for the problems brought to correlative obligee. The engineers encounter some site troubles can contact us, sum up and research the technology issues in the field of soldering and serve for more engineers.
1.Introduction of wave soldering
2.Technological process
Several technological process
A1.1 single machine wave soldering process
A1.2 on-line wave soldering process
3.General operation procedures
B1.1 preparation work
B1.2 operation rules
B2.1 open ventilation switch.
B2.2 boot
B3 Operation process of wave soldering machine on line
B4 operation after soldering
B5 Management of soldering process
4. Analysis of common mechanical failures
1. Wave soldering does not boot
2.Wave soldering without heating
3. Wave soldering without spraying
4. Wave soldering is not constant temperature
5. Wave soldering guide rail is not transmitted
6. wave soldering off plate
7. Wave soldering tin
8. Wave soldering trip
9, wave soldering alarming
5.failure analysis
1.A lot of residue and dirty boards
2.fire
3.corrosion
4.electric leakage
5.Leakage soldering, faulty soldering and continuous soldering
6.Solder joint is too bright or not bright
7.short circuit
8.Heavy smoke and strong smell
9.solder joint not full
10.Flux bad foam
11.Excessive foam
12.FLUX discolor
13.Shedding, peeling, or bubbling
14.Change in the electrical signal at high frequency
6.Solution
1. Lack of solder
2. Too much solder
3. Tin whiskers
4. Leakage soldering
5. Cold soldering
6. Pull point of solder joint
7. Hole
8. Solder ball
9. Porosity (air bubble / pinhole)
10. Poor Wetting
11. Outline of conformal solder joints (welding / dry)
12. The dark granular solder or solder joints
13. Solder joint bridge or short circuit
7.Solution
1. Poor wetting
2. DE WETTING:
3. Cold solder or disturred solder joints
4. Cracks in solder fillet
5. Exces solder
6. Icicling
7. Solder webbing
8. White residue
9. Dark residues and etch marks
10. Green residue
11. White corrosion
12. Pinholds and blowholes
13. Trapped oil
14. Grey solder joint
15. The rough surface of solder joint
16. Yellow solder joint.
17. Bridging
8.Summary of wave soldering
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