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2-2 Non-halogen Lead-free Solder Paste

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2-2-1 Product Introduction

Lead-free & halogen-free solder paste is an environmentally friendly, high-reliability soldering material for surface mount technology (SMT). It is uniformly blended from lead-free solder alloy powder and halogen-free flux. Free of lead and halogen-based activators, it complies with environmental regulations while ensuring long-term safe operation of precision electronic products.

I. Basic Composition

A. Solder Powder

Mainstream alloys are tin‑silver‑copper (SAC305/SAC0307). Low-temperature SnBi and high-temperature SnSb systems are also available, with melting points ranging from 138°C to 230°C, and completely lead‑free.

B. Flux

Free of halogens such as chlorine and bromine. Formulated with organic acids and non-ionic activators to achieve non-corrosiveness, low residue, and high insulation.

II. Product Features

  1. Environmental ComplianceMeets RoHS, REACH, and halogen-free requirements (IEC 61249). Lead content < 1000 ppm, with total halogens controlled at an extremely low level, suitable for high-end products.

  2. Stable Soldering PerformanceExcellent wettability, full solder deposition, bright solder joints, and low voiding rate. Suitable for precision components including 0201, 01005, BGA, and QFN.

  3. Low Residue & No-CleanMinimal and transparent insulating residues after soldering. Allows direct ICT testing and conformal coating without cleaning, simplifying the production process.

  4. High Reliability & Non-CorrosivenessHalogen‑free, eliminating ionic contamination, electrochemical migration, and copper foil corrosion. No leakage or cold joints during long-term use, ideal for automotive, medical, and industrial control equipment.

  5. Excellent PrintabilityHigh thixotropy, enabling continuous printing without stencil clogging or slumping, suitable for high-speed SMT production lines.

III. Application Fields

IV. Differences from Conventional Solder Pastes



2-2-2 Designation, Melting Point and Alloy Compositions

Series                  Melting point(℃)                  Alloy compositions
WH-326G-R(2-2)217-220S-Sn96.5Ag3Cu0.5Ce
WH-373G-R(2-2)216-228S-Sn99Cu0.7Ag0.3
WH-210G-R(2-2)340-240S-Sn95Sb5

2-2-3 Flux Chemical Composition

MaterialsContent(wt%)
Resin40
   Thixotropic agent11
Acid3
Solvent37
   Corrosion inhibitor3
   Viscosity additive2
   Active polymer2

2-2-4 Properties

                 Item                  Data
Halogen content (%)N.D
SIR(Ω)Before soldering>1×1012
Moist resistance>1×1010
Flux content(Wt%)11.5±1.0
Metal content(Wt%)88.5±0.5
Powder size(μm)25~45
Viscosity (Kcps/Pa.s)180±30
Copper mirror corrosionLow
Copper plate corrosionLow, accepted
Collapse testpass
Wetting testpass
Shelf life6 Months (0-10℃)