Solder Paste Series
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Solder Paste Series

2-2-1 Product Introduction
Lead-free & halogen-free solder paste is an environmentally friendly, high-reliability soldering material for surface mount technology (SMT). It is uniformly blended from lead-free solder alloy powder and halogen-free flux. Free of lead and halogen-based activators, it complies with environmental regulations while ensuring long-term safe operation of precision electronic products.
I. Basic Composition
A. Solder Powder
Mainstream alloys are tin‑silver‑copper (SAC305/SAC0307). Low-temperature SnBi and high-temperature SnSb systems are also available, with melting points ranging from 138°C to 230°C, and completely lead‑free.
B. Flux
Free of halogens such as chlorine and bromine. Formulated with organic acids and non-ionic activators to achieve non-corrosiveness, low residue, and high insulation.
II. Product Features
Environmental ComplianceMeets RoHS, REACH, and halogen-free requirements (IEC 61249). Lead content < 1000 ppm, with total halogens controlled at an extremely low level, suitable for high-end products.
Stable Soldering PerformanceExcellent wettability, full solder deposition, bright solder joints, and low voiding rate. Suitable for precision components including 0201, 01005, BGA, and QFN.
Low Residue & No-CleanMinimal and transparent insulating residues after soldering. Allows direct ICT testing and conformal coating without cleaning, simplifying the production process.
High Reliability & Non-CorrosivenessHalogen‑free, eliminating ionic contamination, electrochemical migration, and copper foil corrosion. No leakage or cold joints during long-term use, ideal for automotive, medical, and industrial control equipment.
Excellent PrintabilityHigh thixotropy, enabling continuous printing without stencil clogging or slumping, suitable for high-speed SMT production lines.
III. Application Fields
Automotive electronics (ECUs, lamps, sensors)
Medical equipment and precision instruments
Telecommunication base stations, servers, 5G equipment
High-end consumer electronics, industrial control motherboards
Aerospace and military-grade high-reliability products
IV. Differences from Conventional Solder Pastes
More environmentally friendly than lead-containing solder paste, with no lead toxicity hazards.
Safer than halogen-containing lead-free solder paste, with no risk of ionic corrosion and higher long-term reliability.
2-2-2 Designation, Melting Point and Alloy Compositions
| Series | Melting point(℃) | Alloy compositions |
| WH-326G-R(2-2) | 217-220 | S-Sn96.5Ag3Cu0.5Ce |
| WH-373G-R(2-2) | 216-228 | S-Sn99Cu0.7Ag0.3 |
| WH-210G-R(2-2) | 340-240 | S-Sn95Sb5 |
2-2-3 Flux Chemical Composition
| Materials | Content(wt%) |
| Resin | 40 |
| Thixotropic agent | 11 |
| Acid | 3 |
| Solvent | 37 |
| Corrosion inhibitor | 3 |
| Viscosity additive | 2 |
| Active polymer | 2 |
2-2-4 Properties
| Item | Data | |
| Halogen content (%) | N.D | |
| SIR(Ω) | Before soldering | >1×1012 |
| Moist resistance | >1×1010 | |
| Flux content(Wt%) | 11.5±1.0 | |
| Metal content(Wt%) | 88.5±0.5 | |
| Powder size(μm) | 25~45 | |
| Viscosity (Kcps/Pa.s) | 180±30 | |
| Copper mirror corrosion | Low | |
| Copper plate corrosion | Low, accepted | |
| Collapse test | pass | |
| Wetting test | pass | |
| Shelf life | 6 Months (0-10℃) | |

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