Innovation Forges the Soul, Craftsmanship Leads the Way

Zhongya (Tianjin) Electronic Solder Technology Co., Ltd.

R&D Center Empowers High-End Manufacturing with High-Quality Development

The global manufacturing industry is undergoing a profound transformation toward smarter, greener and more precise production.As international environmental regulations become increasingly stringent, China’s “Dual Carbon” strategy continues to advance, and the strategic value of tin resources grows significantly.Soldering technology serves as a critical connection for electronic manufacturing, aerospace, new energy and other key industries, and its technological evolution directly defines the core competitiveness of the entire industrial chain.

Against this backdrop of industry-wide transformation, the R&D Center of Zhongya (Tianjin) Electronic Solder Technology Co., Ltd. takes innovation as its driving force and professionalism as its foundation.By keeping pace with global industry frontiers, we have built a high-level R&D platform integrating scientific research, technology commercialization, technical support and talent development.Through advanced core technologies, we lead the upgrading of the soldering industry and inject strong momentum into high-end manufacturing worldwide.

As a pioneer in solder research and development, the R&D Center has long adhered to a philosophy of high starting points, high standards and high investment.We established a standardized research laboratory at an early stage, equipped with world-class facilities for solder performance testing, soldering process simulation and environmental reliability testing, laying a solid hardware foundation for continuous innovation.

After more than 20 years of dedicated development, we have built a professional and powerful R&D team composed of materials scientists, senior process engineers, doctors and masters.With core experts boasting over 20 years of industry experience, we focus on key areas including solder material innovation, soldering process optimization and green manufacturing upgrading.We have successfully broken through multiple industry bottlenecks and formed a full-scenario, full-process core technology system that reflects our leading research strength.

To align with market demand and resolve industry challenges, the R&D Center focuses on three core R&D directions:

Green & Low-Carbon Innovation

Responding to global environmental trends and China’s “Dual Carbon” goals, we continuously upgrade lead-free solders and optimize formulations of eco-friendly alloys such as Sn-Ag-Cu and Sn-Bi.We overcome industry-wide challenges including insufficient wettability and unstable reliability of lead-free solders.All products fully comply with EU RoHS, REACH and domestic environmental standards.

Precision & High-End Applications

To meet the high-performance requirements of AI, 5G/6G, new energy vehicles and aerospace, we develop micro-precision soldering technologies and high-temperature resistant solders.These innovations break through the soldering limitations of high-density, miniaturized electronic components, ensuring stable solder joints and efficient signal transmission to support high-end product quality upgrading.

Intelligent & Digital Empowerment

Integrating digital and intelligent technologies, we provide automated soldering solutions and intelligent solder quality inspection systems.We help manufacturers shift from manual operation to intelligent control, improving efficiency, reducing costs and adapting to the trend of smart manufacturing.

Industry-university-research collaboration is key to our technological leadership and efficient commercialization.We have established in-depth cooperation with the School of Materials Science and Technology, Tianjin University, and jointly built a doctoral workstation.Through the “University Research + Enterprise Application” model, we conduct joint research on cutting-edge topics including new soldering materials, advanced processes and supporting electronic chemical technologies, turning lab innovations into industrial productivity.

Supported by continuous R&D investment and outstanding technological achievements, the R&D Center has obtained district-level scientific and technological innovation funding, participated in formulating a number of industry standards, and been granted dozens of patents.We have formed a complete innovation cycle: R&D – Testing – Commercialization – Iteration, setting a benchmark for technological innovation in the soldering industry.

Core Innovative Products

Laser-Specific Solder Paste

Developed for advanced laser soldering applications, this product perfectly matches non-contact heating, localized temperature control and high-precision positioning.With optimized Sn-Ag-Cu formulation, its melting point is precisely controlled at approximately 217°C, ideal for rapid laser heating.

Featuring a stable thixotropic index of 0.55±0.1, it effectively eliminates common problems such as discontinuous dispensing, needle clogging, spattering and solder popping.It supports needles as small as ≥0.15mm inner diameter and ensures consistent output in high-speed automated production.The paste produces extremely low, non-corrosive residues, passes JIS copper corrosion testing, and fully complies with EU RoHS and REACH.It enables soldering within 1 second while ensuring excellent electrical reliability and long-term stability, widely used in precision electronics, AI chips and 5G modules.

High-Performance Tinned Copper Strip

Designed for high-end conductive applications, this product adopts advanced electroplating technology with high-purity copper substrate and uniform, dense tin coating.It achieves outstanding electrical conductivity (close to pure copper) and strong corrosion resistance against atmospheric, industrial and salt-spread environments.

With tensile strength of 360–430MPa, it combines excellent mechanical performance and processability, supporting cold/hot forming, soldering and precision processing.It is widely applied in new energy vehicle connectors, photovoltaic ribbons, electronic pins and cable shielding.By resolving typical weaknesses such as easy oxidation and poor solderability, it fully satisfies the strict reliability requirements of high-end manufacturing.

Customized High-Performance Solder Rings

Targeting high-end electronic assembly and precision instrument connections, these customized solder rings fill the high-end market gap with refined craftsmanship and strict quality control.

Made of high-purity tin-based alloys, they support customizable formulations (Sn-Ag, Sn-Bi, etc.) and full-size specifications from Φ0.5mm to Φ10mm.Thickness tolerance is controlled within ≤±0.02mm, with no burrs or pores, ensuring uniform heating and smooth melting to avoid cold joints or false joints.

Melting points can be customized from 138°C to 230°C to suit various materials and working conditions.With special anti-oxidation surface treatment, they can be stored for over 12 months at room temperature.After soldering, joints are full, bright and residue-free, with tensile strength above 280MPa.They are widely used in precision electronics, sensor packaging, medical devices and high-end instrumentation.

Future Outlook

Faced with global changes in tin supply and challenges from alternative technologies, the R&D Center will continue to deepen technological innovation, especially in eco-friendly solder development and efficient utilization of tin resources.We will keep breaking technical barriers, strengthen our leading position in the industry, and empower global high-end manufacturing with solid R&D capabilities.

Together, we lead the soldering industry toward high-quality development: greener, more precise and more intelligent.